We have been demonstrating development and
manufacture of products gentle to the earth as part of our environmental
preservation activities.
Here, we would like to report about the advancement
of the situation of the lead-free corresponding products.
We had
traditionally applied solder-plating method for the surface treatment of
terminal related parts and products. We have elaborated to improve products with
changing the plating method in which lead is replaced by tin, i.e. lead is not
contained. We have now found this new method we have employed is also excellent
in economical efficiency.
However, there was a problem called "whisker"
which created a peculiar phenomenon for tin-plating.
The plating process was
reexamined and the problem has been cleared, which enabled the process to the
mass-production.
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Lead-Free Program